Honor 700 and Honor 700 Pro Chipset Rumors Surface Ahead of December China Launch

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Honor is expected to reveal its upcoming 700 series in China this December, and new reports have emerged outlining the chipsets likely to power the two models. According to well-known tipster Digital Chat Station, the standard Honor 700 is said to be built around Qualcomm's Snapdragon 8s Gen 4, while the Honor 700 Pro is expected to move up to the Snapdragon 8 Gen 5.

The latest details follow earlier leaks suggesting that the Honor 700 series may support a teleconverter accessory, hinting that Honor may be placing greater emphasis on zoom performance and camera versatility in this upcoming lineup.

If the reports prove accurate, the base Honor 700 could also include a periscope telephoto rear camera, which would be a notable inclusion for a non-Pro model. The Honor 700 Pro, meanwhile, is rumored to feature a 6.57-inch 1.5K display and a 1.72-inch secondary rear screen intended for selfies.

The Pro model is also said to bring a more powerful camera setup, including a 200MP primary sensor and a 50MP periscope telephoto camera. Battery life may also be a highlight, with the phone reportedly packing a battery with a capacity of around 9,000mAh.

These details remain unconfirmed for now, but the leaks suggest that Honor may position the 700 series as a performance-focused lineup with a strong camera setup, larger battery capacity, and a more differentiated Pro variant.

Source (In Chinese)

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