Samsung’s latest Exynos 2600 application processor (AP) not only delivers impressive benchmark performance but also excels in thermal management, thanks to the introduction of its Heat Pass Block (HPB) technology. This innovative cooling solution significantly reduces the chip’s heat levels, enhancing sustained performance and user experience.
Heat Pass Block Technology Keeps Exynos 2600 Cooler
Constructed from copper, the Heat Pass Block serves as an effective heat sink positioned directly on top of the AP. Unlike previous Exynos designs, where the DRAM was stacked on the AP, Samsung relocated the DRAM to the side with the Exynos 2600. This change enables direct contact between the AP and the HPB, allowing efficient heat transfer through conduction to the heat sink’s base. As a result, the Exynos 2600 operates approximately 30% cooler compared to its predecessors.
User Preferences for Galaxy S26 Chipsets
Thermal throttling is a common issue in smartphones, causing devices to slow down after prolonged use due to heat buildup. The HPB addresses this by improving heat dissipation, which extends the AP’s peak performance duration and enhances overall user experience.
Exynos 2600 to Debut in Galaxy S26 Series, Featuring Cutting-Edge Chip Tech
According to sources cited by tech insider Jukan05, Samsung plans to use the Exynos 2600 in select Galaxy S26 models sold in Europe, South Korea, and emerging markets. These will mark the first smartphones to utilize a 2nm process chip—a milestone in the industry. In contrast, units for the U.S., China, and Japan will continue to employ the Snapdragon 8 Elite Gen 5 AP.
Samsung’s HPB packaging technology is expected to become widely available, as Samsung Foundry looks to license it to other giants such as Qualcomm and Apple. Demand for this advanced heat dissipation method is rising, underlining its significance in delivering sustained high performance.
Advancing Semiconductor Technology with Gate-All-Around Transistors
The Galaxy S26 series will also be the first to feature chips built with Gate-All-Around (GAA) transistors. Unlike traditional designs, GAA transistors wrap the gate around all four sides of the transistor channel, reducing leakage current and improving drive efficiency. This results in processors that are both faster and more energy-efficient.
Samsung has already incorporated GAA transistors in its 3nm Exynos W1000 chip powering the Galaxy Watch 7 series, laying the groundwork for this technology's debut in smartphones with the 2nm Exynos 2600.
Samsung Foundry’s Bid to Expand Market Share
Samsung Foundry aims to increase its commercial footprint by leveraging the HPB technology to attract major customers like Apple and Qualcomm away from the dominant TSMC. Despite previous challenges with yield rates that prompted Qualcomm to shift manufacturing back to TSMC in 2022, Samsung has reportedly overcome these obstacles.
The combined advantages of improved yield and superior thermal design via the HPB may enable Samsung Foundry to grow beyond its current 7.3% market share, still far behind TSMC’s commanding 70.2% share.
