Huawei has recently introduced its latest server chip, the Kunpeng 930, which is built on TSMC's advanced 5nm architecture. The chip is expected to deliver a significant performance boost compared to its predecessor, showcasing Huawei's commitment to innovation in the server technology space. While the Kunpeng 930 may not be on par with the latest offerings from Intel and AMD, it represents a step forward for Huawei in the competitive server chip market.
Huawei Kunpeng 930 teardown
The Kunpeng 930 chip boasts a CPU manufactured using TSMC's N5 process, while the I/O die is likely produced using SMIC's 14nm process. With a dual-socket motherboard configuration and the Mount TaiShan CPU architecture, each CPU die in the chip houses 10 CPU clusters, totaling 80 cores. Additionally, each die is equipped with 91MB L3 cache and 2MB L2 cache, along with 96 PCIe lanes and a 16-channel memory connection.
For more detailed insights, be sure to watch the teardown video linked in the source below.
