TSMC's Decision to Remove Chinese Equipment Raises Questions

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Concerns over potential U.S. restrictions on advanced 2nm chip production have led TSMC to remove Chinese equipment from its fabs. This move comes as TSMC gears up for full-scale production using the 2nm process node at facilities in Hsinchu and Kaohsiung. The company is also scrutinizing chemicals and materials sourcing to further reduce Chinese dependencies.
Originally planned for 3nm production lines, the shift underscores TSMC's efforts to maintain operational flexibility. While the true motives behind the decision remain unclear, speculations suggest a strategic move to navigate evolving geopolitical dynamics.
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