Samsung is set to make a significant investment in a chip packaging facility in the USA, totaling more than $7 billion. This move comes as the company aims to strengthen its position in the chip manufacturing segment and meet the growing demand for advanced chips from key clients like Apple and Tesla.
The investment will support the production of 2nm and 4nm chips and will complement Samsung's existing plans for a $37 billion investment in chip manufacturing. By expanding its capabilities in the USA, Samsung aims to mitigate the impact of tariffs and offer a comprehensive manufacturing solution encompassing chip production, packaging, and memory chip manufacturing.
With construction of the Taylor Fab 1 facility nearing completion, Samsung is poised to enhance its competitive edge in the US market and reaffirm its commitment to innovation and growth in the semiconductor industry.
Official confirmation of this investment is expected to be made during an upcoming summit on August 25.
