Recently, Samsung has unveiled a groundbreaking cooling solution for their Exynos 2600 processor. This innovative Heat Pass Block (HPB) technology is designed to efficiently cool the application processor, setting it apart from conventional cooling methods.
Unlike traditional heat spreaders, the HPB integrates a copper heat sink directly into the chip's package-on-package structure, significantly enhancing heat dissipation capabilities.
Expected to debut with the upcoming Galaxy S26 series, the Exynos 2600 processor, built on Samsung's advanced 2nm GAA process, promises impressive performance coupled with efficient cooling.
Stay tuned for the official unveiling of the Exynos 2600 chip alongside the much-anticipated Galaxy S26 series, scheduled for release in the coming months.
