The iPhone 18, set to be released next year, is rumored to be equipped with TSMC's advanced 2nm fabrication process for its SoC. Reports indicate that a new packaging method will also be implemented, with the foundry establishing a dedicated production line for Apple in preparation for mass production in 2026.
Several sources suggest that the A20 chip in the iPhone 18 series will move from InFO packaging to WMCM packaging, offering enhanced performance and efficiency. WMCM allows for the integration of multiple chips in a single package, enabling the creation of more powerful and complex systems that can handle demanding tasks with ease.
WMCM offers increased flexibility by optimizing communication between different types of chips, resulting in improved performance and faster data sharing. This shift in packaging technology could potentially unlock the full potential of the iPhone 18 Pro.
iPhone 16 Pro. | Image Credit - PhoneArena
Apple's relentless pursuit of innovation in chip technology is expected to revolutionize the smartphone industry once again with the release of the iPhone 18 Pro. Stay tuned for more updates on this exciting development.
