Samsung has officially unveiled the new Exynos 2500 chipset, featuring cutting-edge technologies and improvements over its predecessor. Built on Samsung's latest 3nm GAA node and utilizing Fan-Out Wafer-Level Packaging, the Exynos 2500 promises enhanced power efficiency and heat dissipation.
The chipset boasts a 10-core CPU design with a 1+7+2 configuration, including a powerful Cortex-X925 core running at 3.3GHz. The GPU has been upgraded to an Xclipse 950 with enhanced performance and support for ray tracing. Additionally, the NPU offers faster AI processing capabilities, enabling new features and functionalities.
Camera hardware on the Exynos 2500 has also been improved, supporting AI-based image processing for sensors up to 320MP and advanced video recording and playback features. The built-in modem now supports satellite messaging and offers high-speed 5G connectivity.
With mass production underway, the Exynos 2500 is expected to debut in the upcoming Galaxy Z Flip7, showcasing Samsung's commitment to delivering cutting-edge technology to consumers.
