A recent report has uncovered that Huawei is not as close to challenging U.S. chip designers as previously claimed. Despite reports of using a 5nm Kirin X90 processor, it has been revealed that the chip was actually produced using SMIC's 7nm process node (N+2). This discrepancy puts Huawei two generations behind the U.S. in chip technology, with Apple set to further extend this lead with 2nm APs next year.
Huawei's CEO, Ren Zhengfei, had made statements suggesting technological advancement, but the new information casts doubt on these claims. With the gap widening between Huawei and U.S. chip designers, the company faces significant challenges in catching up without access to EUV lithography machines.
