Next year, flagship smartphones are expected to transition from 3nm to 2nm application processors, utilizing advanced Gate-All-Around (GAA) transistors for improved efficiency. As the industry moves towards smaller nodes, the cost of silicon wafers for chip production is projected to reach $45,000 for the 1.4nm Angstrom process by 2028. This substantial increase in pricing poses a challenge for manufacturers, with only the most affluent customers like Apple, Nvidia, AMD, and Broadcom likely able to afford it.
Key players such as Apple have demonstrated their commitment to cutting-edge technology by embracing higher wafer costs for improved performance. MediaTek is also gearing up to unveil its 2nm chip designs later this year, signaling fierce competition in the semiconductor market among major players. TSMC's advancements in process nodes underscore the importance of staying at the forefront of innovation to meet consumer demand for faster, more efficient devices.
While the introduction of 1.4nm chips is still a few years away, the industry's willingness to invest in groundbreaking technology like GAA transistors highlights the relentless pursuit of excellence in semiconductor manufacturing. As companies prepare to adopt these cutting-edge technologies, the landscape of mobile devices and computing is set to evolve drastically in the coming years.
