According to recent reports, Huawei is making strides in chip development, with plans to produce 3nm chips by 2026. The company is working on a 5nm production line that does not require EUV lithography machines, and is utilizing SSA800 lithography machines with multi-patterning technology developed by Shanghai Micro Electronics. This innovative approach allows Huawei to work around restrictions on using standard EUV technology patented by Dutch company ASML, which is prohibited from collaborating with the Chinese manufacturer.
Two approaches are being taken in the research and development of 3nm chips: one involves GAA architecture, which is commonly used by industry competitors TSMC and Samsung, while the other utilizes a carbon nanotube-based chip design that has already undergone successful lab testing and is being adapted for production at SMIC.
Despite facing challenges due to restrictions and limitations, Huawei continues to push the boundaries of chip technology. The recent release of the Huawei Matebook Fold, powered by the Kirin X90 chip, showcases the company's commitment to innovation. Although marketed as a "5nm chip," the Kirin X90 is actually a 7nm design with advanced packaging technology. Despite lower yield rates and higher manufacturing costs, the performance of the chip remains competitive with other 5nm chips in the market.
