Exactly one year ago today we discussed Huawei's plans to collaborate with SMIC on building 3nm chips. A recent report suggests that Huawei has already begun R&D work on a method to produce 3nm chips for the local chip industry using innovative lithography techniques.
Utilizing older Deep Ultraviolet Lithography (DUV) machines, Huawei and SMIC are exploring ways to achieve precision and efficiency in their chip designs. These advancements may bring Huawei closer to competing with industry leaders such as TSMC and Samsung Foundry in producing cutting-edge SoCs.
The 3nm chips under development by Huawei are expected to incorporate Gate-All-Around (GAA) transistors, a technology currently exclusive to Samsung Foundry at the 3nm level. Additionally, Huawei is investigating the use of "two-dimensional" materials and carbon nanotubes to enhance performance and energy efficiency.
Despite facing challenges due to EUV lithography bans, Huawei aims to finalize its 3nm chip design by next year. Once completed, the design will be shared with SMIC for manufacturing preparation, potentially marking a significant milestone in the Chinese chip industry.
