China's largest foundry, SMIC, is facing restrictions preventing it from obtaining advanced lithography machines. Despite this, reports suggest that SMIC may have used older Deep Ultraviolet (DUV) lithography gear to produce Huawei's latest 5nm Kirin X90 chip. This development has sparked intrigue and concern among industry analysts and lawmakers.
The Kirin X90 chip, designed by Huawei's HiSilicon unit, was initially believed to be built on SMIC's 7nm N+2 process node. However, recent reports claim that the chip is actually manufactured using SMIC's 5nm N+3 node, achieved through the use of DUV technology and multiple wafer impressions. This unconventional approach may have significant implications for Huawei's technological capabilities and geopolitical concerns.
While the use of older lithography equipment has raised questions about the chip's performance and yield, it also highlights SMIC's resilience in adapting to challenging circumstances. The potential implications of this development on Huawei's access to cutting-edge silicon technology and its ties to the Chinese military have not gone unnoticed.
