Oppo is set to expand its Find X8 lineup with the anticipated release of the Find X8S in April. This latest model promises to push the boundaries of smartphone design, featuring ultra-thin bezels on all four sides that surpass even those of the Apple iPhone 16 Pro Max.
The bezel thickness will come in at "1.xx mm," a remarkable feat achieved by incorporating a novel COP (Chip-on-Panel) packaging technique developed by Oppo. This innovative approach integrates the display driver chip directly into the screen, eliminating the need for a separate, bulkier driver IC.
While this technology enables a reduction in bezel size and enhances energy efficiency, it does have its downsides. Manufacturing such complex panels is more challenging and typically incurs a higher cost compared to conventional display technologies.
Oppo Find X8 Pro
At the upcoming launch event, Oppo is expected to introduce the Find X8S as the Mini variant in the series. Additionally, a model named Find X8S+ is anticipated, alongside the much-awaited Find X8 Ultra, which is rumored to feature a quintuple camera system for enhanced photography capabilities.
