Honor is making waves in the competitive smartphone landscape, pushing the boundaries of foldable technology to new heights. With the Magic V3 establishing itself as a benchmark for thinness at just 9.2 mm when folded, Honor has already outpaced renowned giants like Samsung and Huawei in various aspects. As the phone industry evolves, Honor is poised to reclaim the title for the world's thinnest foldable smartphone with its much-anticipated Magic V4.
Recent discussions circulating on Weibo suggested that the upcoming device could utilize a downgraded chipset to maintain its slim profile. However, Honor's flagship mobile phone product manager, Li Kun, has put those rumors to rest, confirming that the Magic V4 will utilize premium, full-featured flagship chipsets.
In addition to its sleek design, the Magic V4 is expected to enhance battery performance significantly, likely incorporating a robust 6,000 mAh silicon-carbon battery. This new feature would dramatically surpass the previous model, the Magic V3, which boasts a 5,150 mAh battery. Such advancements suggest that the upcoming Galaxy Z Fold 7 may face stiff competition from Honor's innovative offerings.
