MediaTek has officially launched its latest chipsets, the Dimensity 7400 and 7400X, which represent incremental upgrades from their predecessors, the Dimensity 7300 and 7300X. One of the most notable enhancements is the overclocking of the 4x Cortex-A78 performance cores, now running at a peak frequency of 2.6GHz, an increase of 100 MHz.
Both chipsets feature 2x Cortex-A55 efficiency cores clocked at 2.0 GHz. As seen in last year's models, the Dimensity 7400X variant is designed for dual display support and is set to debut in the upcoming generation of flip foldable devices.
Dimensity 7400 Specifications
The Dimensity 7400 series is manufactured using TSMC’s advanced 4nm process technology, paired with the Arm Mali-G615 GPU. They offer support for LPDDR5 RAM and UFS 3.1 storage, ensuring high-speed performance. Moreover, MediaTek has introduced Adaptive Gaming Technology 3.0, optimizing both performance and battery life.
Dimensity 7400X Specifications
A standout feature of the new chipsets is MediaTek's Network Observation System (NOS), which enhances 5G and Wi-Fi connectivity through smart switching and advanced network predictions. The Dimensity 7400 series includes a 5G modem that supports 3CC carrier aggregation, alongside tri-band Wi-Fi 6E and Bluetooth 5.4 connectivity. Additionally, the Imagiq 950 ISP offers support for 12-bit HDR imaging and camera sensors up to 200MP.
MediaTek has indicated that the first devices powered by the Dimensity 7400 series will be rolling out in Q1 2025.
