MediaTek is poised to introduce its latest lineup of Dimensity chips in an event taking place in China on December 23. While the precise models have yet to be confirmed, industry insiders expect the unveiling of the Dimensity 8400 SoC to be a highlight of the announcement.
According to leaked specifications, the Dimensity 8400 is anticipated to be a 4nm chipset featuring a 1+3+4 core architecture. It will incorporate the Immortalis-G720 MC7 GPU, reportedly achieving impressive benchmarks in AnTuTu testing.
Leaked specifications for the Dimensity 8400 SoC (translated from Chinese)
Additionally, the upcoming Redmi Turbo 4 smartphone is rumored to be among the first devices that will utilize the new Dimensity 8400 chip.
Source (in Chinese)
